CMP, Generally known as thermal oxidation sharpening, makes use of MP at the side of substances to improve the MRR and enhance surface area excellent [twenty]. Determine two illustrates the schematic of an average CMP process [21]. The SiC wafer, that's fastened around the carrier, and the polishing pad move https://www.quora.com/profile/Trevor-Flatcher-2/Prospects-for-Silicon-Carbide-in-Solar-Cells-Silicon-Carbide-SiC-has-emerged-as-a-promising-material-for-enhancing-th